Title :
Integration of a 3D microwave module
Author :
Sun, X. ; Soussan, Ph ; La Manna, A. ; Majeed, B. ; Barbaste, R. ; Monfraix, Ph ; De Raedt, W.
Author_Institution :
Imec, Leuven, Belgium
Abstract :
With respect to a planar approach, 3D stacking of functional layers allows to increase the level of integration and miniaturization of communications systems. For this paper, a full 3D stacking demonstration vehicle has been realized and characterized. The feasibility of a 3D micro-wave module package has been proven by the successful realization of a 30 GHz 3D module including substrate vias, low loss interconnects, substrate shielding and MMIC integration. The impact of wire bond and CAP integration on 3D packaging performance were also investigated.
Keywords :
MMIC; integrated circuit packaging; lead bonding; modules; 3D microwave module integration; 3D microwave module package; CAP integration; MMIC integration; communications systems; frequency 30 GHz; full 3D stacking demonstration vehicle; low loss interconnects; substrate shielding; substrate vias; wire bond; Nickel; Radio frequency;
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
DOI :
10.1109/ESTC.2010.5642931
