DocumentCode
3198794
Title
Integration of a 3D microwave module
Author
Sun, X. ; Soussan, Ph ; La Manna, A. ; Majeed, B. ; Barbaste, R. ; Monfraix, Ph ; De Raedt, W.
Author_Institution
Imec, Leuven, Belgium
fYear
2010
fDate
13-16 Sept. 2010
Firstpage
1
Lastpage
4
Abstract
With respect to a planar approach, 3D stacking of functional layers allows to increase the level of integration and miniaturization of communications systems. For this paper, a full 3D stacking demonstration vehicle has been realized and characterized. The feasibility of a 3D micro-wave module package has been proven by the successful realization of a 30 GHz 3D module including substrate vias, low loss interconnects, substrate shielding and MMIC integration. The impact of wire bond and CAP integration on 3D packaging performance were also investigated.
Keywords
MMIC; integrated circuit packaging; lead bonding; modules; 3D microwave module integration; 3D microwave module package; CAP integration; MMIC integration; communications systems; frequency 30 GHz; full 3D stacking demonstration vehicle; low loss interconnects; substrate shielding; substrate vias; wire bond; Nickel; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location
Berlin
Print_ISBN
978-1-4244-8553-6
Electronic_ISBN
978-1-4244-8554-3
Type
conf
DOI
10.1109/ESTC.2010.5642931
Filename
5642931
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