• DocumentCode
    3199094
  • Title

    Crosstalk analysis in high density connector via pin fields for digital backplane applications using a 12-port vector network analyzer

  • Author

    Kotzev, Miroslav ; Frech, Roland ; Harrer, Hubert ; Kaller, Dierk ; Huber, Andreas ; Winkel, T.-M. ; Brüns, Heinz-Dietrich ; Schuster, Christian

  • Author_Institution
    Inst. fur Theor. Elektrotechnik, Tech. Univ. Hamburg-Harburg, Hamburg, Germany
  • fYear
    2010
  • fDate
    13-16 Sept. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this paper the authors present results from the crosstalk analysis of a high density single ended connector and its associated card via array obtained with 12-port vector network analyzer (VNA) measurements in the bandwidth from 10 MHz up to 20 GHz. The device under test used for this paper is typical for a high end mainframe processor node to node link scenario consisting of daughter cards plugged into a backplane card by using a multipin connector. In previous studies the authors have shown that mainly the connector via pin field is impacting the electrical link performance. Here, the measurements have shown that the via pin field constitutes a complex crosstalk problem depending on the orientation and the distance between victim and aggressor via, the common coupled via lengths, and the local power/ground environment.
  • Keywords
    crosstalk; electric connectors; network analysers; printed circuit accessories; backplane card; card via array; crosstalk analysis; daughter cards; digital backplane; frequency 10 MHz to 20 GHz; high density connector via pin fields; high density single ended connector; mainframe processor node-node link scenario; multipin connector; vector network analyzer; Backplanes; Connectors; Power measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2010 3rd
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4244-8553-6
  • Electronic_ISBN
    978-1-4244-8554-3
  • Type

    conf

  • DOI
    10.1109/ESTC.2010.5642944
  • Filename
    5642944