• DocumentCode
    3199234
  • Title

    Polymer nanofiber based continuous metal phase composite for thermal management applications

  • Author

    Carlberg, Björn ; Liu, Jiangchuan ; Ye, Li-Lei

  • Author_Institution
    Dept. of Microtechnol. & Nanosci. (MC2), Chalmers Univ. of Technol., Gothenburg, Sweden
  • fYear
    2010
  • fDate
    13-16 Sept. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A new composite design approach for thermal interface materials is presented. A porous electrospun nanofiber network composed of temperature stable polyimide was infiltrated with liquid phase indium at a pressure of 30 MPa. The polymer phase defines composition and geometry, while the continuous metal phase gives binding to surfaces and high thermal conductivity. The composite was characterized by assembly of tri-layer copper/TIM/copper sandwich structures and subsequent xenon flash measurements extracting the thermal properties of the intermediate TIM layer. The interfacial contact resistance was found to be 8 Kmm2/W and the thermal conductivity was 28 W/mK, indicating the potential for use in thermal management applications.
  • Keywords
    copper; indium; nanocomposites; polymer fibres; porous materials; sandwich structures; thermal conductivity; thermal management (packaging); Cu; In; continuous metal phase composite; interfacial contact resistance; liquid phase indium; polymer nanofiber; polymer phase; porous electrospun nanofiber network; pressure 30 MPa; sandwich structures; temperature stable polyimide; thermal conductivity; thermal interface materials; thermal management applications; xenon flash measurements; Copper; Detectors; Materials reliability; Phase measurement; Polymers; Thermal conductivity; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic System-Integration Technology Conference (ESTC), 2010 3rd
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4244-8553-6
  • Electronic_ISBN
    978-1-4244-8554-3
  • Type

    conf

  • DOI
    10.1109/ESTC.2010.5642950
  • Filename
    5642950