DocumentCode
3199234
Title
Polymer nanofiber based continuous metal phase composite for thermal management applications
Author
Carlberg, Björn ; Liu, Jiangchuan ; Ye, Li-Lei
Author_Institution
Dept. of Microtechnol. & Nanosci. (MC2), Chalmers Univ. of Technol., Gothenburg, Sweden
fYear
2010
fDate
13-16 Sept. 2010
Firstpage
1
Lastpage
6
Abstract
A new composite design approach for thermal interface materials is presented. A porous electrospun nanofiber network composed of temperature stable polyimide was infiltrated with liquid phase indium at a pressure of 30 MPa. The polymer phase defines composition and geometry, while the continuous metal phase gives binding to surfaces and high thermal conductivity. The composite was characterized by assembly of tri-layer copper/TIM/copper sandwich structures and subsequent xenon flash measurements extracting the thermal properties of the intermediate TIM layer. The interfacial contact resistance was found to be 8 Kmm2/W and the thermal conductivity was 28 W/mK, indicating the potential for use in thermal management applications.
Keywords
copper; indium; nanocomposites; polymer fibres; porous materials; sandwich structures; thermal conductivity; thermal management (packaging); Cu; In; continuous metal phase composite; interfacial contact resistance; liquid phase indium; polymer nanofiber; polymer phase; porous electrospun nanofiber network; pressure 30 MPa; sandwich structures; temperature stable polyimide; thermal conductivity; thermal interface materials; thermal management applications; xenon flash measurements; Copper; Detectors; Materials reliability; Phase measurement; Polymers; Thermal conductivity; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location
Berlin
Print_ISBN
978-1-4244-8553-6
Electronic_ISBN
978-1-4244-8554-3
Type
conf
DOI
10.1109/ESTC.2010.5642950
Filename
5642950
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