Rapid prototyping of electronic modules combining Aerosol printing and Ink Jet printing

Maskless direct printing is a good candidate for rapid prototyping and even emerging for manufacturing of large scale electronics. Aiming for rapid prototyping of small multi-layer modules the study combines Aerosol Jet^® printing and ink jet printing. Conductive silver traces down to 20μm width were printed together with large interconnect areas on isolating layers of inorganic-organic hybrid polymer (ORMOCER^®) and on glass substrates. New copper nickel inks and high-k ORMOCER^®s filled with barium titanate particles are paving a path to integrated printed resistors and capacitors. Although some issues still need to be resolved for a commercial grade process the detail solutions presented for the first time and the active integrated circuits and devices attached to the same substrate demonstrate a path and the principle technical feasibility of this method for heterogeneous integration.