Passive parametric modeling of interconnects and packaging components from sampled impedance, admittance or scattering data

We present a methodology to generate passive parametric macromodels from impedance, admittance or scattering samples. The key features of the proposed approach are two. First, the proposed model is passive by construction over the entire parameter range, and will therefore lead to stable time-domain simulations. Second, the model poles are fully parameterized. This latter feature enables a high fitting accuracy and a reduced model complexity. Two application examples compare the performance of this technique with the state of the art.