• DocumentCode
    3199697
  • Title

    High tech garbage can help engineering colleges to improve hands-on education

  • Author

    De Lucena, Samuel E.

  • Author_Institution
    Sao Paulo State Univ., Sao Paulo, Brazil
  • fYear
    2011
  • fDate
    12-15 Oct. 2011
  • Abstract
    This paper presents a discussion on the potential use of high tech garbage, including electronic waste (e-waste), as a source of mechanisms, sensors and actuators, that can be adapted to improve the reality of microprocessor systems labs, at low cost. By means of some examples, it is shown that entire subsystems withdrawn of high tech equipments can be easily integrated into existing laboratory infrastructure. As examples, first a precision positioning mechanism is presented, which was taken from a discarded commercial ink jet printer and interfaced with a microprocessor board used in the laboratory classes. Secondly, a read/write head and its positioning mechanism has been withdrawn of a retired CD/DVD drive and again interfaced with the microprocessor board. Students who have been using these new experiments strongly approve their inclusion in the lab schedules.
  • Keywords
    computer aided instruction; disc drives; educational institutions; ink jet printers; laboratories; microcomputers; waste; CD-DVD drive; compact disc; digital video disc; discarded commercial ink jet printer; e-waste; electronic waste; engineering college; hands-on education; high tech garbage; microprocessor board; microprocessor system laboratory; precision positioning mechanism; read-write head; Choppers; DC motors; Electronic waste; Magnetic heads; Microprocessors; Optical sensors; Electrical Engineering labs; Electronic waste; Hands-on education; High tech garbage; Optical encoders;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frontiers in Education Conference (FIE), 2011
  • Conference_Location
    Rapid City, SD
  • ISSN
    0190-5848
  • Print_ISBN
    978-1-61284-468-8
  • Electronic_ISBN
    0190-5848
  • Type

    conf

  • DOI
    10.1109/FIE.2011.6142725
  • Filename
    6142725