DocumentCode
3199885
Title
CMOS-SOI-MEMS transistor (TeraMOS) for Terahertz Imaging
Author
Corcos, D. ; Goren, D. ; Nemirovsky, Y.
Author_Institution
Dept. of Electr. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
fYear
2009
fDate
9-11 Nov. 2009
Firstpage
1
Lastpage
5
Abstract
This study presents a new sensor for Terahertz Imaging, dubbed here as TeraMOS, which is based on several leading technologies: CMOS-SOI (Silicon on Insulator), MEMS (Micro Electro Mechanical Systems) and Terahertz Photonics. The paper focuses on the electrical characterization of CMOS-SOI "virgin" (unreleased) transistors fabricated in the IBM 0.18¿m RF CMOS-SOI advanced process. By applying MEMS post processing to thermally isolate the transistors, the resulting CMOS-SOI-MEMS transistors become highly sensitive active bolometers - the TeraMOS sensors. The measured Temperature Coefficient of Current (TCC) as a function of temperature, gate voltage and drain current is presented. A new suggested figure of merit for the TeraMOS sensors is defined by TCC2·I and measured values of it are presented.
Keywords
CMOS image sensors; MOSFET; bolometers; micromechanical devices; silicon-on-insulator; terahertz wave detectors; terahertz wave imaging; CMOS-SOI-MEMS transistor; MEMS; TeraMOS; TeraMOS sensors; active bolometers; micro electro mechanical systems; silicon on insulator; size 0.18 mum; temperature coefficient of current; terahertz imaging; terahertz photonics; Image sensors; Mechanical sensors; Micromechanical devices; Optical imaging; Optoelectronic and photonic sensors; Sensor phenomena and characterization; Silicon on insulator technology; Temperature measurement; Temperature sensors; Transistors; CMOS; MOS transistors; Silicon-on-Insulator (SOI); Temperature Coefficient of Current (TCC); Terahertz sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwaves, Communications, Antennas and Electronics Systems, 2009. COMCAS 2009. IEEE International Conference on
Conference_Location
Tel Aviv
Print_ISBN
978-1-4244-3985-0
Type
conf
DOI
10.1109/COMCAS.2009.5386033
Filename
5386033
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