• DocumentCode
    3199885
  • Title

    CMOS-SOI-MEMS transistor (TeraMOS) for Terahertz Imaging

  • Author

    Corcos, D. ; Goren, D. ; Nemirovsky, Y.

  • Author_Institution
    Dept. of Electr. Eng., Technion - Israel Inst. of Technol., Haifa, Israel
  • fYear
    2009
  • fDate
    9-11 Nov. 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This study presents a new sensor for Terahertz Imaging, dubbed here as TeraMOS, which is based on several leading technologies: CMOS-SOI (Silicon on Insulator), MEMS (Micro Electro Mechanical Systems) and Terahertz Photonics. The paper focuses on the electrical characterization of CMOS-SOI "virgin" (unreleased) transistors fabricated in the IBM 0.18¿m RF CMOS-SOI advanced process. By applying MEMS post processing to thermally isolate the transistors, the resulting CMOS-SOI-MEMS transistors become highly sensitive active bolometers - the TeraMOS sensors. The measured Temperature Coefficient of Current (TCC) as a function of temperature, gate voltage and drain current is presented. A new suggested figure of merit for the TeraMOS sensors is defined by TCC2·I and measured values of it are presented.
  • Keywords
    CMOS image sensors; MOSFET; bolometers; micromechanical devices; silicon-on-insulator; terahertz wave detectors; terahertz wave imaging; CMOS-SOI-MEMS transistor; MEMS; TeraMOS; TeraMOS sensors; active bolometers; micro electro mechanical systems; silicon on insulator; size 0.18 mum; temperature coefficient of current; terahertz imaging; terahertz photonics; Image sensors; Mechanical sensors; Micromechanical devices; Optical imaging; Optoelectronic and photonic sensors; Sensor phenomena and characterization; Silicon on insulator technology; Temperature measurement; Temperature sensors; Transistors; CMOS; MOS transistors; Silicon-on-Insulator (SOI); Temperature Coefficient of Current (TCC); Terahertz sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwaves, Communications, Antennas and Electronics Systems, 2009. COMCAS 2009. IEEE International Conference on
  • Conference_Location
    Tel Aviv
  • Print_ISBN
    978-1-4244-3985-0
  • Type

    conf

  • DOI
    10.1109/COMCAS.2009.5386033
  • Filename
    5386033