DocumentCode :
3199894
Title :
Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers
Author :
Ng, Jack Hoyd-Gigg ; Flynn, David ; Lacrotte, Yves ; Desmulliez, Marc P Y ; Ssekitoleko, Robert ; Démoré, Christine ; Cochran, Sandy
Author_Institution :
Microsyst. Eng. Centre (MISEC), Heriot-Watt Univ., Edinburgh, UK
fYear :
2010
fDate :
13-16 Sept. 2010
Firstpage :
1
Lastpage :
6
Abstract :
The development trends of ultrasonic devices dictate that frequencies increase, electrode element counts increase, and element pitch dimensions shrink. The high density of the small pitch electrode elements combined with the challenging geometry of the device design, and considerations of acoustic impedance and signal interference, mean that new assembly and packaging techniques are required to be developed to form the interconnection between the high frequency ultrasound (HFUS) arrays and external circuitry. Novel assembly methods using photolithography of new epoxy composite alumina/SU-8 and high density flexible circuits, precision dicing of lead zirconate titanate (PZT) material, flexible circuits and SU-8 resin, powder blasting for vias structuring, and conductive and adhesive films bonding are considered as a mass-scale production approach.
Keywords :
adhesives; alumina; assembling; interference (signal); packaging; ultrasonic transducer arrays; acoustic impedance; adhesive films; assembly methods; epoxy composite alumina; fabrication; high frequency ultrasound array; lead zirconate titanate; packaging techniques; pitch electrode elements; signal interference; ultrasonic transducers; Acoustics; Assembly; Lithography; Powders; Substrates; Transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-8553-6
Electronic_ISBN :
978-1-4244-8554-3
Type :
conf
DOI :
10.1109/ESTC.2010.5642978
Filename :
5642978
Link To Document :
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