Future high security ID documents based on innovative microsystem technologies

The development of novel and highly secure ID systems calls for ongoing technical and economic innovation. In 2005, the German ePassport was introduced by Bundesdruckerei GmbH. The embedded electronic components are based on well-known silicon technology and a conventional wired antenna. In order to implement new types of contactless high-security ID documents, this paper describes the development of novel system integration technologies based on flexible electronics. This new technology concept makes it possible to integrate electrical, mechanical, optical, biochemical components and interfaces to form suitable building blocks for future ID documents. These smart systems place extreme demands on heterogeneous system integration. This is the reason why the ID security document is becoming a main technology driver in microsystem technology.