SCB - Stamped Circuit Board technology

Summary form only given. With its Stamped Circuit Board (SCB) technology Heraeus is able to offer a comprehensive concept for the realization of reliable and low cost solutions to thermal dissipation. Whilst requirements are ever increasing, electronic systems themselves continue to become smaller and more complex. Capacities are greater, and the respective power losses have to be dealt with in an intelligent way. In this respect, a tremendous importance becomes attached to a cleverly devised form of thermal management. The SCB technology, performing as chip carrier, thus makes a definitive contribution towards the electrical and thermal properties and plays a pivotal role through the use of many different kinds of thermally conductive metals, or alternatively metal alloys. SCB is the technology for printed circuit boards of miniaturized design. The high-precision procedures are ideally suited to the manufacture of the tiniest structures and to large quantities. The low material thicknesses enable flat package heights, and have the additional advantage of being considerably more flexible. Components can be affixed directly to the underlying metal layer using a conductive adhesive and contacted over the rear side of the metal. In the case of temperature-sensitive components this leads to the creation of an optimal thermal management as the heat can be immediately directed away through the conductive copper layer. As a result, by using the inexpensive SCB mass production process it is now possible to attain modular components that yield a total thermal conductivity comparable to that of ceramics, or even insert molded plastic parts. This presentation is directed at engineers, R&D people and managers in the field of semiconductor packaging and assembly technologies as well as electronic packaging and electronic components.