DocumentCode
3200576
Title
Influence of accelerated aging on the acoustic properties of a ceramic microsystem for structural health monitoring
Author
Hildebrandt, Samuel ; Boehme, Bjoern ; Wolter, Klaus-juergen
Author_Institution
Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany
fYear
2010
fDate
13-16 Sept. 2010
Firstpage
1
Lastpage
5
Abstract
Carbon fibre reinforced polymers (CFRP) are widely used wherever weight has to be reduced without compromising the mechanical properties of parts. One popular application is in aerospace. To reduce failure analysis (maintenance) time and eventually detect impacts even during flight it is necessary to durably mount an array of miniaturized sensors on CFRP elements. Especially the acoustic properties of the interface (adhesive) between ultrasound transducer and CFRP need to be constant over time (or at least show an predictable behaviour). LTCC-based transducers allow the integration of reliable electronics into the ultrasound sensor. For electrical circuits on ceramic substrates, lifetime predictions are basically known. In contrast, no investigations about the “acoustic lifetime” of an ultrasound sensor interface are known. The paper describes the fabrication and assembly of realistic test specimens as well as the accelerated aging by temperature cycling and temperature / humidity test. To evaluate the adhesive, lifelike ultrasound signals are sent and received with different types of solid mount LTCC-based sensors. Furthermore the electrical impedance of the piezoelectric transducers is analyzed.
Keywords
ageing; carbon fibre reinforced composites; condition monitoring; failure analysis; life testing; microsensors; piezoelectric transducers; sensor arrays; structural engineering; CFRP elements; LTCC-based transducers; accelerated aging; acoustic properties; carbon fibre reinforced polymers; ceramic microsystem; ceramic substrates; electrical circuits; electrical impedance; failure analysis; humidity test; miniaturized sensor array; piezoelectric transducers; solid mount LTCC-based sensors; structural health monitoring; temperature cycling; temperature testing; ultrasound transducer; Acoustics; Impedance; Sensors; Substrates; Transducers; Ultrasonic imaging; Ultrasonic variables measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic System-Integration Technology Conference (ESTC), 2010 3rd
Conference_Location
Berlin
Print_ISBN
978-1-4244-8553-6
Electronic_ISBN
978-1-4244-8554-3
Type
conf
DOI
10.1109/ESTC.2010.5643012
Filename
5643012
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