• DocumentCode
    3200634
  • Title

    RISE: 21.5% Efficient Back Junction Silicon Solar Cell with Laser Technology as a Key Processing Tool

  • Author

    Engelhart, P. ; Harder, N.P. ; Merkle, A. ; Grischke, R. ; Meyer, R. ; Brendel, R.

  • Author_Institution
    Inst. fur Solarenergieforschung Hameln, Emmerthal
  • Volume
    1
  • fYear
    2006
  • fDate
    38838
  • Firstpage
    900
  • Lastpage
    904
  • Abstract
    We employ laser technology as a key processing tool for fabricating our novel RISE (rear interdigitated single evaporation) silicon solar cells. The contactless production sequence incorporates a self-aligning single evaporation step for metallising the interdigitated rear contacts. In this paper, we compare in detail the performance of two types of RISE solar cells with different contact formations to the base: (a) back surface field formation via aluminium doping produced by local laser-firing of the aluminium contact (Al-BSF) and (b) local diffusion of boron (B-BSF). The best solar cell with B-BSF has an AM 1.5 efficiency of 21.5 %. The efficiencies of RISE solar cells with Al-BSF are considerably lower due to 5-10 % lower short-circuit currents. We ascribe these photocurrent losses to a less-efficient BSF effect of the laser-fired contact compared to a boron-diffused BSF
  • Keywords
    diffusion; elemental semiconductors; silicon; solar cells; 21.5 percent; RISE solar cells; Si; aluminium doping; back surface field formation; diffusion; key processing tool; laser technology; laser-firing; rear interdigitated single evaporation; silicon solar cell; Aluminum; Chemical lasers; Costs; Fabrication; Geometrical optics; Metallization; Photovoltaic cells; Production; Silicon; Surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    1-4244-0017-1
  • Electronic_ISBN
    1-4244-0017-1
  • Type

    conf

  • DOI
    10.1109/WCPEC.2006.279601
  • Filename
    4059774