DocumentCode :
3201023
Title :
28th Annual Proceedings. Reliability Physics 1990 (Cat. No.90CH2787-0)
fYear :
1990
fDate :
27-29 March 1990
Keywords :
electric breakdown of solids; electromigration; failure analysis; integrated circuit technology; packaging; reliability; semiconductor technology; voids (solid); GaAs; charge trapping; device issues; electromigration; failure analysis; ferroelectrics; nitride dielectrics; oxide breakdown; packaging issues; reliability; reliability assessment; stress-induced voiding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 1990. 28th Annual Proceedings., International
Conference_Location :
New Orleans, LA, USA
Type :
conf
DOI :
10.1109/RELPHY.1990.66104
Filename :
66104
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3201023
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