• DocumentCode
    3201365
  • Title

    Greater Than 16% Efficient Screen Printed Solar Cells on 115-170 μm Thick Cast Multicrystalline Silicon

  • Author

    Upadhyaya, Ajay ; Sheoran, Manav ; Ristow, Alan ; Rohatg, Ajeet ; Narayanan, S. ; Roncin, Steve

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Univ. Center of Excellence for Photovoltaics & Educ., Atlanta, GA
  • Volume
    1
  • fYear
    2006
  • fDate
    7-12 May 2006
  • Firstpage
    1052
  • Lastpage
    1055
  • Abstract
    In this paper we report on the impact of mc-Si wafer thickness on efficiency. We have obtained 16.8%, 16.4%, 16.2% and 15.7% efficient screen printed 4 cm2 solar cells on 280 mum, 170 mum, 140 mum and 115 mum thick cast mc-Si respectively. Analysis of these cells showed that the efficiency of the 115 mum thick cell is limited by a BSRV of 750 cm/s, FSRV of 120,000 cm/s and a BSR of 67%. A module manufacturing cost model for a 25 MW plant was used to demonstrate that 15.7% efficient cells on 115 mum thick wafers are more cost effective than 16.8% cells on 280 mum wafers. The module manufacturing cost reduced from $1.82/W to $1.63/W when the wafer thickness was reduced from 280 mum (efficiency 16.8%) to 115 mum (efficiency 15.7%). A roadmap is developed for 115 mum thick wafers to demonstrate how cell efficiency can be increased to greater than 18% resulting in a module cost of less than $1.40/W
  • Keywords
    elemental semiconductors; semiconductor device manufacture; silicon; solar cells; 115 micron; 140 micron; 15.7 percent; 16.2 percent; 16.4 percent; 16.8 percent; 170 micron; 25 MW; 280 micron; BSR; BSRV; FSRV; Si; manufacturing cost model; multicrystalline silicon; screen printed solar cells; wafer thickness; Coatings; Computer science education; Costs; Educational technology; Passivation; Photovoltaic cells; Physics education; Production; Semiconductor device modeling; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    1-4244-0016-3
  • Electronic_ISBN
    1-4244-0017-1
  • Type

    conf

  • DOI
    10.1109/WCPEC.2006.279321
  • Filename
    4059812