DocumentCode :
3201865
Title :
An oscillator design using low g-sensitivity, low phase noise STW devices
Author :
Cavin, Mark S. ; Almar, Rodolfo C.
Author_Institution :
Sawtek Inc., Orlando, FL, USA
fYear :
1995
fDate :
31 May-2 Jun 1995
Firstpage :
476
Lastpage :
485
Abstract :
Focuses upon results of integrating surface transverse wave (STW) technology into an oscillator product line. Phase noise of <-100 dBc/Hz at 100 Hz, noise floor of <-180 dBc/Hz, and g-sensitivity of <5×10-10 per g have been achieved at 1 GHz using STW technology. Select units have exhibited g-sensitivities below 1×10 -10 per g. These 1/f and g-sensitivity results represent state of the art for 1 GHz STW oscillators. The above low phase noise and low g-sensitivity (<5×10-10 per g) have been achieved in a 1.5"×1"×.2" package. In addition, this g-sensitivity performance is attained in an industry-standard, 14-pin dual in-line package (DIP) measuring 87"×.5"×.24". Bare hybrid oscillator products with hermetically-sealed resonators have been developed at a size of .715"×.380"×.110" for subsequent hermetic module integration. Design techniques have resulted in production of standard oscillators From 300 MHz to nearly 1200 MHz and over temperature ranges from -55 degrees Celsius to +110 degrees Celsius using the exact same hybrid substrate design. The design of this hybrid circuit is discussed
Keywords :
1/f noise; UHF oscillators; hybrid integrated circuits; integrated circuit packaging; packaging; phase noise; seals (stoppers); surface acoustic wave oscillators; -55 to 110 degC; 1/f results; 300 to 1200 MHz; STW devices; dual in-line package; hermetic module integration; hermetically-sealed resonators; hybrid substrate design; low g-sensitivity; oscillator product line; phase noise; surface transverse wave technology; Circuits; Frequency; Inductors; Oscillators; Packaging; Phase noise; Radiofrequency interference; Resonator filters; Surface acoustic waves; Surface waves;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frequency Control Symposium, 1995. 49th., Proceedings of the 1995 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-2500-1
Type :
conf
DOI :
10.1109/FREQ.1995.483937
Filename :
483937
Link To Document :
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