DocumentCode
3202055
Title
24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492)
fYear
2001
fDate
5-9 May 2001
Abstract
The following topics were dealt with. Education; adhesives; sputtering; PCBs; MCMs; fault tolerance; low power electronics; reliability; moisture; LTCC; thick film resistors; CAD; sensors; neural networks; and SMT
Keywords
CAD; adhesives; concurrent engineering; education; fault tolerance; low-power electronics; multichip modules; neural nets; packaging; printed circuits; reliability; sensors; sputtering; surface mount technology; thick film resistors; CAD; LTCC; MCMs; PCBs; SMT; adhesives; education; fault tolerance; low power electronics; moisture; neural networks; reliability; sensors; sputtering; thick film resistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
Conference_Location
Calimanesti-Caciulata, Romania
Print_ISBN
0-7803-7111-9
Type
conf
DOI
10.1109/ISSE.2001.930992
Filename
930992
Link To Document