DocumentCode :
3202055
Title :
24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492)
fYear :
2001
fDate :
5-9 May 2001
Abstract :
The following topics were dealt with. Education; adhesives; sputtering; PCBs; MCMs; fault tolerance; low power electronics; reliability; moisture; LTCC; thick film resistors; CAD; sensors; neural networks; and SMT
Keywords :
CAD; adhesives; concurrent engineering; education; fault tolerance; low-power electronics; multichip modules; neural nets; packaging; printed circuits; reliability; sensors; sputtering; surface mount technology; thick film resistors; CAD; LTCC; MCMs; PCBs; SMT; adhesives; education; fault tolerance; low power electronics; moisture; neural networks; reliability; sensors; sputtering; thick film resistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
Conference_Location :
Calimanesti-Caciulata, Romania
Print_ISBN :
0-7803-7111-9
Type :
conf
DOI :
10.1109/ISSE.2001.930992
Filename :
930992
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3202055
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