DocumentCode
3202077
Title
How to teach electronics packaging technology?
Author
Vitez, Zsolt Illyefalvi ; Hajdu, Istvhn ; Ripka, Gabor
Author_Institution
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary
fYear
2001
fDate
2001
Firstpage
7
Lastpage
12
Abstract
The preparation of engineers for the 21st century´s requirements of rapidly developing information technology as well as microelectronics and electronics packaging technology is a real challenge for education. An approach that teaches electronics packaging technology and associated topics, providing lecture courses, lab sessions and independent research studies supported by a prototype manufacturing environment can hopefully achieve the main goals. Supporting projects are also essential for the department in order to develop the prototyping laboratories. From a teaching viewpoint, the advanced educational structure and the application of appropriate didactic methods has great importance. The Faculty of Electrical Engineering and Informatics at the Budapest University of Technology and Economics retained both the electronics and the technical informatics topics in the curriculum that enables teaching of both topics on a wider horizon. The curriculum has three levels. In the first semester, natural sciences and computer programming are taught. In the middle of the curriculum, emphasis is laid on the core knowledge of electronics and information technology. In the final semester, specific courses are organized to teach current information on selected subjects. The teaching of electronics packaging technology meets the requirements of this three-level approach. A method developed by the Department of Electronics Technology (BME-ETT) is also demonstrated which makes education in electronics packaging technology more efficient
Keywords
computer science education; electronic engineering education; packaging; rapid prototyping (industrial); teaching; computer programming; didactic methods; education; educational structure; electronics; electronics packaging technology; information technology; lab sessions; lecture courses; microelectronics packaging technology; natural sciences; prototype manufacturing environment; prototyping laboratories; research studies; teaching; Design engineering; Education; Educational technology; Electronics packaging; Informatics; Information technology; Laboratories; Manufacturing; Microelectronics; Prototypes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
Conference_Location
Calimanesti-Caciulata
Print_ISBN
0-7803-7111-9
Type
conf
DOI
10.1109/ISSE.2001.930994
Filename
930994
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