Embedded passive components for MCM

Author

Golonka, L.J. ; Wolter, K.-J. ; Dziedzic, A. ; Kita, J. ; Rebenklau, L.

Author_Institution

Inst. of Microsyst. Technol., Wroclaw Univ. of Technol., Poland

fYear

2001

fDate

2001

Firstpage

73

Lastpage

77

Abstract

MCMs often have a large number of passive components connected to a small number of active devices. Integration of passive components into the MCM substrate improves electrical properties and reliability, and also reduces the cost, size and weight of electronic systems. The embedded components are mostly used in MCM-D (thin film) and MCM-C (thick film) modules. The use of embedded elements for MCM-L is at the early stage of development. The basic information on embedded passives as well as the activity of Dresden University of Technology and Wroclaw University of Technology in the area of LTCC buried passives is presented

Keywords

buried layers; capacitors; ceramic packaging; inductors; integrated circuit interconnections; integrated circuit packaging; multichip modules; resistors; LTCC buried passives; MCM; MCM substrate; MCM-C; MCM-D; MCM-L; active devices; electrical properties; electronic system cost; electronic system size; electronic system weight; embedded passive components; passive component integration; passive components; reliability; Capacitors; Ceramics; Components, packaging, and manufacturing technology; Consumer electronics; Costs; Dielectric substrates; Electronics packaging; Integrated circuit interconnections; Microelectronics; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on

Conference_Location

Calimanesti-Caciulata

Print_ISBN

0-7803-7111-9

Type

conf

DOI

10.1109/ISSE.2001.931015

Filename

931015