DocumentCode
3202379
Title
Ink jet print head producing simulation and methods
Author
Dimitrov, Nikolay ; Philippov, Philipp
Author_Institution
Dept. KTPPME, Tech. Univ. Sophia, Bulgaria
fYear
2001
fDate
2001
Firstpage
88
Abstract
Summary form only given. The process for manufacturing a thin film resistor substrate is useful in fabricating an ink jet print head, wherein discontinuous strips of conductive material are initially patterned on the surface of a resistive layer. Thermal ink jet print heads play a dominant role in drop-on-demand print head technology. Improvements of efficiency and lifetime are an ongoing challenge for research and development in this field. Commonly used micro heaters are based on refractory metal alloys. Therefore, a complex stack of various materials is necessary to protect the heater against oxidation and mechanical strains that limit the performance of such micro heaters. In this paper, production simulations play a dominant role in making the product cost effective. We research methods of production simulation for thin film devices for an ink jet print head
Keywords
corrosion protection; digital simulation; electronic engineering computing; electronic equipment manufacture; heating elements; ink jet printers; oxidation; thin film resistors; discontinuous conductive material strips; drop-on-demand print head technology; efficiency; ink jet print head; ink jet print head fabrication; ink jet print head production simulation; lifetime; manufacturing process; mechanical strain protection; micro heaters; oxidation protection; product cost effectiveness; production simulation; production simulations; protective material stack; refractory metal alloys; resistive layer surface patterning; thermal ink jet print heads; thin film devices; thin film resistor substrate; Conducting materials; Conductive films; Ink jet printing; Manufacturing processes; Production; Protection; Research and development; Resistors; Strips; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
Conference_Location
Calimanesti-Caciulata
Print_ISBN
0-7803-7111-9
Type
conf
DOI
10.1109/ISSE.2001.931018
Filename
931018
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