• DocumentCode
    3202379
  • Title

    Ink jet print head producing simulation and methods

  • Author

    Dimitrov, Nikolay ; Philippov, Philipp

  • Author_Institution
    Dept. KTPPME, Tech. Univ. Sophia, Bulgaria
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    88
  • Abstract
    Summary form only given. The process for manufacturing a thin film resistor substrate is useful in fabricating an ink jet print head, wherein discontinuous strips of conductive material are initially patterned on the surface of a resistive layer. Thermal ink jet print heads play a dominant role in drop-on-demand print head technology. Improvements of efficiency and lifetime are an ongoing challenge for research and development in this field. Commonly used micro heaters are based on refractory metal alloys. Therefore, a complex stack of various materials is necessary to protect the heater against oxidation and mechanical strains that limit the performance of such micro heaters. In this paper, production simulations play a dominant role in making the product cost effective. We research methods of production simulation for thin film devices for an ink jet print head
  • Keywords
    corrosion protection; digital simulation; electronic engineering computing; electronic equipment manufacture; heating elements; ink jet printers; oxidation; thin film resistors; discontinuous conductive material strips; drop-on-demand print head technology; efficiency; ink jet print head; ink jet print head fabrication; ink jet print head production simulation; lifetime; manufacturing process; mechanical strain protection; micro heaters; oxidation protection; product cost effectiveness; production simulation; production simulations; protective material stack; refractory metal alloys; resistive layer surface patterning; thermal ink jet print heads; thin film devices; thin film resistor substrate; Conducting materials; Conductive films; Ink jet printing; Manufacturing processes; Production; Protection; Research and development; Resistors; Strips; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
  • Conference_Location
    Calimanesti-Caciulata
  • Print_ISBN
    0-7803-7111-9
  • Type

    conf

  • DOI
    10.1109/ISSE.2001.931018
  • Filename
    931018