• DocumentCode
    3202380
  • Title

    Photonics and electronics integration in the HELIOS project

  • Author

    Fedeli, J.M. ; Augendre, E. ; Hartmann, J.-M. ; Vivien, L. ; Grosse, P. ; Mazzocchi, V. ; Bogaerts, W. ; Van Thourhout, D. ; Schrank, F.

  • Author_Institution
    LETI, Minatec, Grenoble, France
  • fYear
    2010
  • fDate
    1-3 Sept. 2010
  • Firstpage
    356
  • Lastpage
    358
  • Abstract
    The objective of the European project HELIOS is to combine a photonic layer with a CMOS circuit by different innovative means, using microelectronics processes. Bonding of AWG + Ge Photodiodes on CMOS wafer is achieved.
  • Keywords
    CMOS integrated circuits; elemental semiconductors; germanium; integrated optoelectronics; micro-optics; optical receivers; photodetectors; wafer bonding; AWG-Ge photodiodes; CMOS circuit; HELIOS project; electronics integration; microelectronics; photonics integration; wafer bonding; Arrayed waveguide gratings; CMOS integrated circuits; Metals; Photodiodes; Photonics; Silicon; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Group IV Photonics (GFP), 2010 7th IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-6344-2
  • Type

    conf

  • DOI
    10.1109/GROUP4.2010.5643326
  • Filename
    5643326
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3202380