DocumentCode
3202441
Title
Single-trial laser-evoked potentials feature extraction for prediction of pain perception
Author
Gan Huang ; Ping Xiao ; Li Hu ; Hung, Y.S. ; Zhiguo Zhang
Author_Institution
Dept. of Electr. & Electron. Eng., Univ. of Hong Kong, Hong Kong, China
fYear
2013
fDate
3-7 July 2013
Firstpage
4207
Lastpage
4210
Abstract
Pain is a highly subjective experience, and the availability of an objective assessment of pain perception would be of great importance for both basic and clinical applications. The objective of the present study is to develop a novel approach to extract pain-related features from single-trial laser-evoked potentials (LEPs) for classification of pain perception. The single-trial LEP feature extraction approach combines a spatial filtering using common spatial pattern (CSP) and a multiple linear regression (MLR). The CSP method is effective in separating laser-evoked EEG response from ongoing EEG activity, while MLR is capable of automatically estimating the amplitudes and latencies of N2 and P2 from single-trial LEP waveforms. The extracted single-trial LEP features are used in a Naïve Bayes classifier to classify different levels of pain perceived by the subjects. The experimental results show that the proposed single-trial LEP feature extraction approach can effectively extract pain-related LEP features for achieving high classification accuracy.
Keywords
Bayes methods; electroencephalography; feature extraction; medical signal processing; regression analysis; signal classification; Bayes classifier; CSP method; EEG activity; MLR; high classification accuracy; high subjective experience; laser-evoked EEG response; multiple linear regression; pain perception classification; pain perception prediction; pain-related LEP features; single-trial LEP feature extraction approaches; single-trial LEP waveforms; single-trial laser-evoked potentials; Accuracy; Band-pass filters; Electroencephalography; Feature extraction; Lasers; Pain; Training;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6610473
Filename
6610473
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