• DocumentCode
    3202523
  • Title

    Modeling moisture caused failures in stress tests

  • Author

    Bojta, Péter

  • Author_Institution
    Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    129
  • Lastpage
    132
  • Abstract
    The most important time related parameter of electronic systems is MTTF (mean time to failure). In accelerated aging tests, the circuits are exposed to enormously harsh environmental conditions. The accelerating parameters and events like mechanical vibration and shock, temperature, pressure, humidity and their combinations are used as loads in stress test methods. There are different models to describe the effects caused by the mentioned stresses. In most cases, these models only include some of the parameters, but none describe all the possible effects of a stress test. By obtaining more information about the materials used in the test vehicle and integrating the available models, it is possible to derive a mostly complete model of moisture permeation, including ad-/absorption and diffusion effects. This paper gives an overview of the available models and shows a first-enclosing simulation of moisture penetration
  • Keywords
    adsorption; ageing; circuit simulation; dynamic testing; environmental degradation; environmental stress screening; failure analysis; humidity; integrated circuit modelling; integrated circuit packaging; integrated circuit testing; life testing; moisture; thermal stresses; MTTF; accelerated aging tests; accelerating parameters; diffusion effects; electronic systems; harsh environmental conditions; humidity; mean time to failure; mechanical shock; mechanical vibration; moisture absorption; moisture adsorption; moisture caused failure modelling; moisture penetration simulation; moisture permeation; pressure; stress test effects; stress test loads; stress test methods; stress tests; temperature; test vehicle; Accelerated aging; Circuit testing; Electric shock; Humidity; Life estimation; Materials testing; Moisture; Stress; Temperature; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
  • Conference_Location
    Calimanesti-Caciulata
  • Print_ISBN
    0-7803-7111-9
  • Type

    conf

  • DOI
    10.1109/ISSE.2001.931030
  • Filename
    931030