• DocumentCode
    3202886
  • Title

    Accelerated life time test methods for new package technologies

  • Author

    Németh, Pál

  • Author_Institution
    Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    215
  • Lastpage
    219
  • Abstract
    This paper describes some life time test methods, equipment and processes for evaluating the most important reliability parameters of new packaging technologies. Another goal of the paper is to introduce some models of the life time acceleration. The most commonly used stresses are: temperature-related accelerated test; temperature cycling; thermal shock, which can be more severe than temperature cycling, as it has very fast ramp rates and shorter cycle times; temperature, humidity and bias (THB, 85°C/85%RH); pressure cooker (PCT) and unsaturated pressure cooker test (USPCT); highly accelerated stress test (HAST); some nonaccelerated methods, such as shock, vibration, etc. The paper gives a detailed description of the most effective and economical HAST method
  • Keywords
    dynamic testing; electronic equipment testing; humidity; life testing; packaging; reliability; thermal shock; thermal stresses; 85 C; HAST method; PCT; USPCT; accelerated life time test methods; cycle times; life time acceleration models; life time test equipment; life time test methods; life time test processes; nonaccelerated methods; package technologies; packaging; pressure cooker test; ramp rates; reliability parameters; shock test; temperature cycling test; temperature-related accelerated test; temperature/humidity/bias testing; thermal shock test; unsaturated pressure cooker test; vibration test; Acceleration; Chip scale packaging; Electronic packaging thermal management; Electronics packaging; Life estimation; Life testing; Packaging machines; Plastic packaging; Temperature; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
  • Conference_Location
    Calimanesti-Caciulata
  • Print_ISBN
    0-7803-7111-9
  • Type

    conf

  • DOI
    10.1109/ISSE.2001.931061
  • Filename
    931061