• DocumentCode
    3202957
  • Title

    Film uniformity and substrate-to-electrode attachment in large-area VHF glow-discharge deposition of a-Si:H [solar cells]

  • Author

    Meiling, H. ; van Sark, W.G.J.H.M. ; Bezemer, J. ; Schropp, R.E.I. ; van der Weg, W.F.

  • Author_Institution
    Debye Res. Inst., Utrecht Univ., Netherlands
  • fYear
    1996
  • fDate
    13-17 May 1996
  • Firstpage
    1153
  • Lastpage
    1156
  • Abstract
    The authors have discovered one of the major causes of thickness nonuniformities in large-area deposition of hydrogenated amorphous silicon, a-Si:H, on glass. The influence of a gap between the substrate and the grounded electrode on the deposition rate is presented. At a gap of 0.85 mm and at an RF excitation frequency of 40 MHz, the reduction of the deposition rate is 15%, whereas at 60 MHz it amounts to 25%. The deposition-rate reduction is described in terms of a reduced voltage across the sheath at the substrate electrode. The observed effects stress the importance of proper substrate-to-electrode attachment when the VHF glow-discharge technique is used for deposition of solar cells on large areas
  • Keywords
    amorphous semiconductors; electrodes; elemental semiconductors; hydrogen; plasma deposited coatings; plasma deposition; semiconductor device testing; semiconductor doping; semiconductor growth; semiconductor thin films; silicon; solar cells; substrates; 0.85 mm; 40 MHz; 60 MHz; Si:H; a-Si:H solar cells; deposition rate; film uniformity; grounded electrode; large-area VHF glow-discharge deposition; semiconductor; substrate-to-electrode attachment; Amorphous silicon; Atomic layer deposition; Electrodes; Frequency; Glass; Laboratories; Photovoltaic cells; Production; Substrates; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 1996., Conference Record of the Twenty Fifth IEEE
  • Conference_Location
    Washington, DC
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-3166-4
  • Type

    conf

  • DOI
    10.1109/PVSC.1996.564336
  • Filename
    564336