DocumentCode
3203100
Title
A new interconnection technique for the attachment of sensors
Author
Mündlein, M. ; Brunner, A. ; Chabicovsky, R. ; Stangl, G. ; Nicolics, J.
Author_Institution
Inst. of Ind. Electron. & Mater. Sci., Tech. Univ. Wien, Austria
fYear
2001
fDate
2001
Firstpage
277
Lastpage
281
Abstract
For many applications, absolutely flat sensor surfaces are needed to bring the sensor´s active structure into intimate contact with a specimen surface. To fulfil this requirement, a new interconnection technique is presented. It is based on funnel-shaped holes drilled into the substrate using a laser. After plating the contact pads with a solderable metallization, the funnel mouth serves as a reservoir for solder or conductive adhesive. This method allows formation of robust contacts between wires leaded-in from the rear side of the sensor substrate, rather than towering above its active surface. In this paper, we demonstrate the application of this method to the manufacturing of human skin moisture sensors. The laser drilling process, photolithography, thin film sputtering and etching techniques are described in detail with respect to peculiarities related to the funnel surfaces. In our case, the active sensor surface consists of a pair of comb-shaped molybdenum electrodes for the skin moisture measurement, and a molybdenum meander track for the measurement of the skin temperature. A good interconnection system was obtained with a solderable metallization system consisting of a double layer of NiCr-Au deposited on a base layer of Mo
Keywords
biosensors; electrochemical electrodes; electrochemical sensors; etching; interconnections; laser beam machining; metallisation; moisture measurement; photolithography; skin; sputter deposition; temperature measurement; Mo base layer; Mo-NiCr-Au; active sensor surface; comb-shaped molybdenum electrode pair; conductive adhesive; contact pad plating; double NiCr-Au layer; etching techniques; flat sensor surfaces; funnel mouth reservoir; funnel surfaces; funnel-shaped holes; human skin moisture sensors; interconnection system; interconnection technique; laser drilling; laser drilling process; molybdenum meander track; photolithography; robust contact formation; sensor active structure; sensor attachment; sensor substrate rear side wires; skin moisture measurement; skin temperature measurement; solder; solderable metallization; solderable metallization system; specimen surface contact; thin film sputtering; Conductive adhesives; Metallization; Moisture measurement; Mouth; Reservoirs; Robustness; Skin; Sputtering; Substrates; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on
Conference_Location
Calimanesti-Caciulata
Print_ISBN
0-7803-7111-9
Type
conf
DOI
10.1109/ISSE.2001.931081
Filename
931081
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