• DocumentCode
    3203460
  • Title

    Selective Laser Ablation of Anti-Reflection Coatings for Novel Metallization Techniques

  • Author

    Grohe, A. ; Harmel, C. ; Knorz, A. ; Glunz, S.W. ; Preu, R. ; Willeke, G.P.

  • Author_Institution
    Fraunhofer Inst. for Solar Energy Syst., Reiburg
  • Volume
    2
  • fYear
    2006
  • fDate
    38838
  • Firstpage
    1399
  • Lastpage
    1402
  • Abstract
    The industrial standard process for producing solar cell front sides includes several drawbacks. First of all the screen-printed front side metallisation with silver paste leads to contacts with a poor aspect ratio and a low conduction quality due to the composition of a printable paste. Additionally, the poor contact resistance requires high surface doping concentrations of the emitter. When using further developed cell concepts like the laser-fired contacted rear side (LFC) featuring dielectric passivation and a local point contact structure, the high-temperature step for establishing the front contact is detrimental too. A solution for this problem could be the use of alternative front side metallisation techniques. Without firing through they all require a selective opening of the front side antireflection coating. The approach studied in this paper is the selective laser ablation of this layer
  • Keywords
    antireflection coatings; contact resistance; doping profiles; elemental semiconductors; laser ablation; metallisation; passivation; silicon; solar cells; LFC; Si; antireflection coatings; contact resistance; crystalline silicon solar cells; dielectric passivation; industrial standard process; laser ablation; laser-fired contact; metallization techniques; point contact structure; silver paste; solar cell; surface doping concentrations; Coatings; Contact resistance; Dielectrics; Doping; Laser ablation; Metallization; Photovoltaic cells; Silver; Surface emitting lasers; Surface resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    1-4244-0017-1
  • Electronic_ISBN
    1-4244-0017-1
  • Type

    conf

  • DOI
    10.1109/WCPEC.2006.279713
  • Filename
    4059908