• DocumentCode
    3203700
  • Title

    Towards a fully integrated electronic nose SoC

  • Author

    Chiu, Shih-Wen ; Wang, Jen-Huo ; Lin, Guan-Ting ; Chang, Chia-Lin ; Chen, Hsin ; Tang, Kea-Tiong

  • Author_Institution
    Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2012
  • fDate
    5-8 Aug. 2012
  • Firstpage
    166
  • Lastpage
    169
  • Abstract
    Electronic noses (e-nose) have been studied for several years and extensively applied; however, they are limited by their volume and high manufacturing cost. Portable devices have become popular in recent years; therefore, it is crucial to integrate e-noses in portable devices (e.g., mobile phones). This study used TSMC 90nm 1P9M CMOS MSG technology to develop a front-end system-on-chip (SoC) for an electronic nose. The SoC contained interdigitated electrodes, multi-channel sensor interface circuits, an analog to digital converter, and a digital continuous restricted Boltzmann machine (CRBM). Various conducting-polymer materials were titrated on the interdigitated electrodes to form an on-chip sensor array. This SoC was controlled through an external microcontroller to perform odor identification and analysis. The simulation results of the SoC and gas classification show that this chip is suitable for portable applications and further integration.
  • Keywords
    CMOS integrated circuits; conducting polymers; electrodes; electronic noses; microcontrollers; sensor arrays; system-on-chip; TSMC 90nm 1P9M CMOS MSG technology; analog to digital converter; conducting-polymer materials; digital continuous restricted Boltzmann machine; e-nose; fully integrated electronic nose SoC; interdigitated electrodes; microcontroller; mobile phones; multichannel sensor interface circuits; odor identification; on-chip sensor array; portable devices; system-on-chip; Arrays; Capacitors; Electrodes; Electronic noses; Materials; Sensors; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (MWSCAS), 2012 IEEE 55th International Midwest Symposium on
  • Conference_Location
    Boise, ID
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4673-2526-4
  • Electronic_ISBN
    1548-3746
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2012.6291983
  • Filename
    6291983