DocumentCode
3203762
Title
Estimation of shear-stress-induced endothelial nitric oxide production from flow-mediated dilation
Author
Yamazaki, Yasuyuki ; Kondo, Yuta ; Kamiyama, Youichi
Author_Institution
Knowledge Hub Aichi Priority Res. Projects, Aichi Sci. & Technol. Found., Toyota, Japan
fYear
2013
fDate
3-7 July 2013
Firstpage
4521
Lastpage
4524
Abstract
Vascular endothelial function assessment yields important diagnostic and prognostic information on patients with (or at risk of) cardiovascular diseases. Flow-mediated dilation (FMD) is the most widely used noninvasive method for assessing the endothelial function. In this method, the magnitude of FMD is used as a surrogate marker for the endothelial function. However, because vasodilation is affected by several other factors as well, the details of how this marker represents the endothelial function are not fully understood. Previously, we developed a mathematical model for vasodilation with intra- and intercellular pathways. In this study, we estimated the shear-stress-induced endothelial nitric oxide production from FMD measurements using the model. The results suggested that the accuracy of the estimated endothelial function obeys the characteristics of the shear stress added to the vascular wall. Furthermore, we showed that the FMD response describes not only the endothelial function but also vascular wall characteristics.
Keywords
biomechanics; cardiovascular system; cellular biophysics; nitrogen compounds; physiological models; FMD measurement; FMD response; NO; cardiovascular disease; endothelial nitric oxide production; flow-mediated dilation; intercellular pathway; intracellular pathway; mathematical model; shear stress characteristics; shear-stress estimation; vascular endothelial function assessment; vascular wall characteristics; vasodilation; Computational modeling; Estimation; Mathematical model; Muscles; Physiology; Production; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6610552
Filename
6610552
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