• DocumentCode
    3203859
  • Title

    Functional simulation of the cochlea for implant optimization

  • Author

    Ceresa, Mario ; Perez, Federico ; Vera, S. ; Carranza, Noemi ; Herrero Jover, Javier ; Mistrik, Pavel ; Gonzalez Ballester, Miguel A.

  • Author_Institution
    Alma IT Syst., Barcelona, Spain
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    4541
  • Lastpage
    4544
  • Abstract
    Cochlear implantation is a surgical technique which aims to restore hearing in people with deep hearing loss. However, outcomes of the surgery still exhibit a large variability between patients. Among the factors that contribute to variability the most important are morphological differences in anatomical structures between patients and incorrect implant placements. In order to address these issues, it would be desirable to have a functional model of the cochlea which incorporates inter-patients variability and simulate electrode placement. To this end, we present a finite element model which captures the interaction between the cochlear partition, modeled as an elastic solid with finite deformation, and the perilymph fluid, modeled as a compressible, viscous fluid. Numerical results show that the membrane responds to changes in the stimulation frequencies.
  • Keywords
    biomechanics; cochlear implants; deformation; ear; elasticity; finite element analysis; medical disorders; physiological models; anatomical structures; cochlea functional model; cochlea functional simulation; cochlear implant optimization; cochlear partition; compressible viscous fluid; deep hearing loss; elastic solid deformation; electrode placement; finite element model; hearing restoration; implant placement; interpatient variability; perilymph fluid; surgery; Auditory system; Equations; Mathematical model; Solid modeling; Solids; Tensile stress; Elmer; FEM; cochlear partition; fluid-structure interaction; perilymph;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6610557
  • Filename
    6610557