DocumentCode
3203912
Title
Semiconductor device reliability in extreme high temperature space environments
Author
Anderson, Wallace T.
Author_Institution
Naval Res. Lab., Washington, DC, USA
Volume
5
fYear
2001
fDate
2001
Firstpage
2457
Abstract
Reliability at high temperatures is one of the most important problems for electronic components operating in extreme space environments. High temperature operation not only reduces the performance of electronic devices, but also greatly shortens their lifetime. The electronic devices are usually designed for room temperature performance. In this paper a review is made of high temperature reliability testing of solid-state electronic components. To date, most of this work has been concerned with high temperature stressing, usually for short periods of time (less than 100 hours) to demonstrate stability. Comprehensive high temperature reliability studies will be required to field high temperature devices for future space exploration
Keywords
HEMT integrated circuits; environmental stress screening; failure analysis; field effect MMIC; high-temperature electronics; integrated circuit reliability; integrated circuit testing; life testing; power semiconductor devices; reviews; semiconductor device reliability; semiconductor device testing; space vehicle electronics; PHEMT MMIC; electronic components; extreme high temperature space environment; failure analysis; high temperature reliability testing; high temperature stressing; life testing; power semiconductor device; semiconductor device reliability; Electronic components; FETs; Failure analysis; Gallium arsenide; HEMTs; Life testing; PHEMTs; Semiconductor device reliability; Semiconductor devices; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace Conference, 2001, IEEE Proceedings.
Conference_Location
Big Sky, MT
Print_ISBN
0-7803-6599-2
Type
conf
DOI
10.1109/AERO.2001.931206
Filename
931206
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