• DocumentCode
    3204116
  • Title

    Developments in elastic memory composite materials for spacecraft deployable structures

  • Author

    Tupper, Michael ; Munshi, Naseem ; Beavers, Fred ; Gall, Ken ; Mikuls, M. ; Meink, Troy

  • Author_Institution
    Composite Technol. Dev. Inc., Lafayett, CO, USA
  • Volume
    5
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    2541
  • Abstract
    Near-term and future spacecraft and satellites will require large ultra-lightweight structures and components that must be efficiently packaged for launch and reliably deployed on orbit. A new material technology called Elastic Memory Composite (EMC) materials, shows promise in meeting these needs. The EMC polymer matrix materials enable a fully cured composite structure or component to be deformed or folded for efficient packaging into a spacecraft or launch vehicle, then regain its original shape with no degradation or loss in mechanical or physical properties. A component using EMC materials is fabricated in its deployed, on orbit shape using conventional composite manufacturing processes. Then by heating the material and applying force this fully cued composite material can be folded or deformed for packaging. When cooled, it will retain the packaged shape indefinitely. When reheated the structure will regain its original shape with little or no external force. This packaging/deployment cycle is reversible. This paper reviews new developments in EMC materials technology including material properties, analytical and designs tools, testing and evaluation protocols, and new applications
  • Keywords
    composite materials; elasticity; filled polymers; intelligent materials; intelligent structures; packaging; EMC polymer matrix materials; Elastic Memory Composite; applications; composite materials; elastic memory; evaluation protocols; heating; mechanical properties; physical properties; spacecraft deployable structures; Aircraft manufacture; Composite materials; Electromagnetic compatibility; Materials science and technology; Packaging; Polymers; Satellites; Shape; Space vehicles; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Conference, 2001, IEEE Proceedings.
  • Conference_Location
    Big Sky, MT
  • Print_ISBN
    0-7803-6599-2
  • Type

    conf

  • DOI
    10.1109/AERO.2001.931215
  • Filename
    931215