DocumentCode :
3204116
Title :
Developments in elastic memory composite materials for spacecraft deployable structures
Author :
Tupper, Michael ; Munshi, Naseem ; Beavers, Fred ; Gall, Ken ; Mikuls, M. ; Meink, Troy
Author_Institution :
Composite Technol. Dev. Inc., Lafayett, CO, USA
Volume :
5
fYear :
2001
fDate :
2001
Firstpage :
2541
Abstract :
Near-term and future spacecraft and satellites will require large ultra-lightweight structures and components that must be efficiently packaged for launch and reliably deployed on orbit. A new material technology called Elastic Memory Composite (EMC) materials, shows promise in meeting these needs. The EMC polymer matrix materials enable a fully cured composite structure or component to be deformed or folded for efficient packaging into a spacecraft or launch vehicle, then regain its original shape with no degradation or loss in mechanical or physical properties. A component using EMC materials is fabricated in its deployed, on orbit shape using conventional composite manufacturing processes. Then by heating the material and applying force this fully cued composite material can be folded or deformed for packaging. When cooled, it will retain the packaged shape indefinitely. When reheated the structure will regain its original shape with little or no external force. This packaging/deployment cycle is reversible. This paper reviews new developments in EMC materials technology including material properties, analytical and designs tools, testing and evaluation protocols, and new applications
Keywords :
composite materials; elasticity; filled polymers; intelligent materials; intelligent structures; packaging; EMC polymer matrix materials; Elastic Memory Composite; applications; composite materials; elastic memory; evaluation protocols; heating; mechanical properties; physical properties; spacecraft deployable structures; Aircraft manufacture; Composite materials; Electromagnetic compatibility; Materials science and technology; Packaging; Polymers; Satellites; Shape; Space vehicles; Thermal degradation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference, 2001, IEEE Proceedings.
Conference_Location :
Big Sky, MT
Print_ISBN :
0-7803-6599-2
Type :
conf
DOI :
10.1109/AERO.2001.931215
Filename :
931215
Link To Document :
بازگشت