DocumentCode :
3204276
Title :
Implementation of parallel processors with wafer scale integration
Author :
Callaway, Thomas K. ; Swartzlander, Earl E., Jr.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
fYear :
1992
fDate :
23-26 Mar 1992
Firstpage :
268
Lastpage :
274
Abstract :
The use of a design strategy employing a hierarchy of structures, each with its own fault circumvention strategy can greatly improve the yield of WSI. The paper examines two strategies for use at the macrocell level in implementing parallel processors. The two basic types of pooled macrocell redundancy are: 1 from N, and many from N. The use of either of these two strategies results in a premium being placed on the interconnect, which is often taken for granted. The paper demonstrates that the interconnect is a vital part of any macrocell pooled redundancy scheme
Keywords :
VLSI; circuit layout CAD; parallel architectures; WSI yield; fault circumvention strategy; interconnect; macrocell level; parallel processors; pooled macrocell redundancy; wafer scale integration; Circuit faults; Integrated circuit interconnections; Macrocell networks; Packaging; Parallel processing; Power system interconnection; Random access memory; Redundancy; Signal processing; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Parallel Processing Symposium, 1992. Proceedings., Sixth International
Conference_Location :
Beverly Hills, CA
Print_ISBN :
0-8186-2672-0
Type :
conf
DOI :
10.1109/IPPS.1992.223034
Filename :
223034
Link To Document :
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