DocumentCode
3204675
Title
DC electrical breakdown of water in a sub-micron planar gap
Author
Song, Chunrong ; Wang, Pingshan
Author_Institution
Dept. of Electr. & Comput. Eng., Clemson Univ., Clemson, SC, USA
fYear
2009
fDate
June 28 2009-July 2 2009
Firstpage
561
Lastpage
564
Abstract
Water breakdown subjected to uniform DC electric field in 300 nm planar gaps is experimentally studied. Test devices with microstrip line configurations are fabricated through nanofabrication technology and the results show that water breakdown occurs at ~ 100 kV/cm electric field under current system setup. The initiation process of water breakdown in a small gap is discussed. It is most likely being initialized by pre-existed bubbles or bubbles generated from electrolysis of water. Electrode surface roughness is examined and its effect on observed water breakdown is investigated. Therefore, the process for electrode fabrication needs to be carefully chosen and the fabrication procedures need to be optimized to provide smooth surfaces without sharp tips or micro protrusions in future water breakdown investigations.
Keywords
dielectric materials; electric breakdown; electrodes; electrolysis; microstrip lines; nanofabrication; surface roughness; water; DC electrical breakdown; H2O; bubbles; dc electric field; electrode surface roughness; electrolysis; microprotrusions; microstrip line configurations; nanofabrication technology; submicron planar gap; water breakdown; Breakdown voltage; Dielectric breakdown; Electric breakdown; Electrodes; Etching; Fabrication; Gold; Microstrip; Wafer bonding; Water;
fLanguage
English
Publisher
ieee
Conference_Titel
Pulsed Power Conference, 2009. PPC '09. IEEE
Conference_Location
Washington, DC
Print_ISBN
978-1-4244-4064-1
Electronic_ISBN
978-1-4244-4065-8
Type
conf
DOI
10.1109/PPC.2009.5386340
Filename
5386340
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