• DocumentCode
    3204675
  • Title

    DC electrical breakdown of water in a sub-micron planar gap

  • Author

    Song, Chunrong ; Wang, Pingshan

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Clemson Univ., Clemson, SC, USA
  • fYear
    2009
  • fDate
    June 28 2009-July 2 2009
  • Firstpage
    561
  • Lastpage
    564
  • Abstract
    Water breakdown subjected to uniform DC electric field in 300 nm planar gaps is experimentally studied. Test devices with microstrip line configurations are fabricated through nanofabrication technology and the results show that water breakdown occurs at ~ 100 kV/cm electric field under current system setup. The initiation process of water breakdown in a small gap is discussed. It is most likely being initialized by pre-existed bubbles or bubbles generated from electrolysis of water. Electrode surface roughness is examined and its effect on observed water breakdown is investigated. Therefore, the process for electrode fabrication needs to be carefully chosen and the fabrication procedures need to be optimized to provide smooth surfaces without sharp tips or micro protrusions in future water breakdown investigations.
  • Keywords
    dielectric materials; electric breakdown; electrodes; electrolysis; microstrip lines; nanofabrication; surface roughness; water; DC electrical breakdown; H2O; bubbles; dc electric field; electrode surface roughness; electrolysis; microprotrusions; microstrip line configurations; nanofabrication technology; submicron planar gap; water breakdown; Breakdown voltage; Dielectric breakdown; Electric breakdown; Electrodes; Etching; Fabrication; Gold; Microstrip; Wafer bonding; Water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Pulsed Power Conference, 2009. PPC '09. IEEE
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-4064-1
  • Electronic_ISBN
    978-1-4244-4065-8
  • Type

    conf

  • DOI
    10.1109/PPC.2009.5386340
  • Filename
    5386340