DocumentCode :
3204722
Title :
A selective area metal bonding method for Si photonics light sources
Author :
Hong, Tao ; Wang, Yang ; Yu, Hong-Yan ; Yue, Song ; Chen, Wei-Xi ; Liang, Song ; Li, Zhi ; Pan, Jiao-Qing ; Ran, Guang-Zhao
Author_Institution :
State Key Lab. for Mesoscopic Phys., Peking Univ., Beijing, China
fYear :
2010
fDate :
1-3 Sept. 2010
Firstpage :
13
Lastpage :
15
Abstract :
A 1.55 μm hybrid InGaAsP-Si laser was fabricated by the selective area metal bonding method. Room temperature continuous lasing with a maximum output power of 0.45 mW is realized.
Keywords :
III-V semiconductors; bonding processes; distributed feedback lasers; elemental semiconductors; gallium arsenide; indium compounds; light sources; quantum well lasers; silicon; waveguide lasers; InGaAsP-Si; continuous lasing; hybrid laser fabrication; multiple quantum well distributed feedback waveguide laser; photonics light sources; power 0.45 mW; selective area metal bonding method; temperature 293 K to 298 K; wavelength 1.55 mum; Bonding; Metals; Optical waveguides; Photonics; Pump lasers; Silicon; Waveguide lasers; InGaAsP-Si Laser; Selective area metal bonding (SAMB); Si photonics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Group IV Photonics (GFP), 2010 7th IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-6344-2
Type :
conf
DOI :
10.1109/GROUP4.2010.5643442
Filename :
5643442
Link To Document :
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