Title :
Recent advance in technologies for commercial millimeter-wave systems
Author_Institution :
TRW Inc., Redondo Beach, CA, USA
Abstract :
Summary form only given, as follows. The practicality of producing high yield, commercially oriented components for use at MM-wave frequency has been brought about by recent advances in MMIC (microwave/millimeter-wave monolithic integrated circuit) and low cost packaging technologies, as well as emerging MM-wave systems requirement. In this presentation, potential system applications, such as wireless communications, multi-point distribution, automotive, and radiometric imaging are discussed. The status of the associated technologies, and circuit design methodology based on technologies such as GaAs and InP MMICs are presented. The manufacturing aspects, packaging and assembly for large volume production are also addressed. With these new advances, it is expected that MM-wave systems will become more affordable for commercial applications in the near future
Keywords :
MIMIC; gallium arsenide; indium compounds; integrated circuit design; integrated circuit manufacture; integrated circuit packaging; integrated circuit technology; EHF; GaAs; GaAs MIMICs; InP; InP MIMICs; assembly; circuit design methodology; commercial MM-wave systems; large volume production; low cost packaging technologies; manufacturing; millimeter-wave systems; Components, packaging, and manufacturing technology; Costs; Integrated circuit packaging; Integrated circuit technology; Integrated circuit yield; MIMICs; MMICs; Millimeter wave integrated circuits; Millimeter wave technology; Radiofrequency integrated circuits;
Conference_Titel :
Microwave Conference Proceedings, 1997. APMC '97, 1997 Asia-Pacific
Print_ISBN :
962-442-117-X
DOI :
10.1109/APMC.1997.654649
