Recent advance in technologies for commercial millimeter-wave systems

Author

Hung, H.A.

Author_Institution

TRW Inc., Redondo Beach, CA, USA

fYear

1997

fDate

2-5 Dec 1997

Abstract

Summary form only given, as follows. The practicality of producing high yield, commercially oriented components for use at MM-wave frequency has been brought about by recent advances in MMIC (microwave/millimeter-wave monolithic integrated circuit) and low cost packaging technologies, as well as emerging MM-wave systems requirement. In this presentation, potential system applications, such as wireless communications, multi-point distribution, automotive, and radiometric imaging are discussed. The status of the associated technologies, and circuit design methodology based on technologies such as GaAs and InP MMICs are presented. The manufacturing aspects, packaging and assembly for large volume production are also addressed. With these new advances, it is expected that MM-wave systems will become more affordable for commercial applications in the near future

Keywords

MIMIC; gallium arsenide; indium compounds; integrated circuit design; integrated circuit manufacture; integrated circuit packaging; integrated circuit technology; EHF; GaAs; GaAs MIMICs; InP; InP MIMICs; assembly; circuit design methodology; commercial MM-wave systems; large volume production; low cost packaging technologies; manufacturing; millimeter-wave systems; Components, packaging, and manufacturing technology; Costs; Integrated circuit packaging; Integrated circuit technology; Integrated circuit yield; MIMICs; MMICs; Millimeter wave integrated circuits; Millimeter wave technology; Radiofrequency integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings, 1997. APMC '97, 1997 Asia-Pacific

Print_ISBN

962-442-117-X

Type

conf

DOI

10.1109/APMC.1997.654649

Filename

654649