DocumentCode
3205385
Title
Substrate noise coupling in mixed-signal ICs
Author
Mahin, M.M. ; Yuan, J.S. ; Whittakar, A. ; Chian, M. ; Ports, K.
Author_Institution
Dept. of Electr. & Comput. Eng., Central Florida Univ., Orlando, FL, USA
fYear
1998
fDate
24-26 Apr 1998
Firstpage
166
Lastpage
169
Abstract
In this paper, we investigate the substrate noise coupling in the mixed-signal IC and its effect on the analog/digital circuits. A proper simulation technique for mixed-signal circuits in SPICE, operating at high speeds and high frequencies, is developed
Keywords
SPICE; circuit analysis computing; integrated circuit noise; mixed analogue-digital integrated circuits; SPICE; analog/digital circuits; high frequency operation; high speed operation; mixed-signal IC; simulation technique; substrate noise coupling; Analog integrated circuits; Circuit noise; Circuit simulation; Coupling circuits; Digital circuits; Frequency; Integrated circuit noise; Inverters; SPICE; Signal design;
fLanguage
English
Publisher
ieee
Conference_Titel
Southeastcon '98. Proceedings. IEEE
Conference_Location
Orlando, FL
Print_ISBN
0-7803-4391-3
Type
conf
DOI
10.1109/SECON.1998.673318
Filename
673318
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