DocumentCode
320540
Title
Analysis of densely packed microstrip interconnects
Author
Lin, Chien-Min ; Chan, Chi Hou
Author_Institution
Dept. of Electron. Eng., City Univ., Hong Kong
fYear
1997
fDate
2-5 Dec 1997
Firstpage
841
Abstract
An iterative technique for analyzing the large-scale microstrip interconnect problems is presented in this paper. It entails the use of the RWG triangular discretization for modeling flexibility and the complex image method and FFT for numerical efficiency. Examples of complicated microstrip interconnect configurations are presented
Keywords
fast Fourier transforms; integrated circuit interconnections; iterative methods; microstrip circuits; microstrip lines; packaging; sparse matrices; FFT; RWG triangular discretization; complex image method; densely packed microstrip interconnects; electronic packaging; iterative technique; large-scale microstrip interconnect problems; Electromagnetic analysis; Electronics packaging; Green´s function methods; Impedance; Integrated circuit interconnections; Large-scale systems; Matrix decomposition; Microstrip; Sparse matrices; Transmission line matrix methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference Proceedings, 1997. APMC '97, 1997 Asia-Pacific
Print_ISBN
962-442-117-X
Type
conf
DOI
10.1109/APMC.1997.654673
Filename
654673
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