DocumentCode :
3205629
Title :
Linear parameter varying identification of ankle joint intrinsic stiffness during imposed walking movements
Author :
Sobhani Tehrani, Ehsan ; Jalaleddini, Kian ; Kearney, Robert E.
Author_Institution :
Dept. of Biomed. Eng., McGill Univ., Montréal, QC, Canada
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
4923
Lastpage :
4927
Abstract :
This paper describes a novel model structure and identification method for the time-varying, intrinsic stiffness of human ankle joint during imposed walking (IW) movements. The model structure is based on the superposition of a large signal, linear, time-invariant (LTI) model and a small signal linear-parameter varying (LPV) model. The methodology is based on a two-step algorithm; the LTI model is first estimated using data from an unperturbed IW trial. Then, the LPV model is identified using data from a perturbed IW trial with the output predictions of the LTI model removed from the measured torque. Experimental results demonstrate that the method accurately tracks the continuous-time variation of normal ankle intrinsic stiffness when the joint position changes during the IW movement. Intrinsic stiffness gain decreases from full plantarflexion to near the mid-point of plantarflexion and then increases substantially as the ankle is dosriflexed.
Keywords :
biological tissues; biomechanics; elastic constants; physiological models; time-varying systems; IW movement; LPV model; LTI model; ankle dosriflexion; continuous-time variation; human ankle joint intrinsic stiffness; identification method; imposed walking movement; joint position; model structure; normal ankle intrinsic stiffness; plantarflexion mid-point; signal linear-parameter varying model; time-invariant model; time-varying model; two-step algorithm; unperturbed IW trial; Data models; Joints; Muscles; Predictive models; TV; Torque; Trajectory;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6610652
Filename :
6610652
Link To Document :
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