Title :
Comparison of solid state, MPM, and TWT based transmitters for spaceborne applications
Author :
Smith, Matthew C. ; Dunleavy, Lawrence P.
Author_Institution :
Raytheon E-Syst. St. Petersburg, FL, USA
Abstract :
This study compares current and projected state-of-the-art microwave power amplifiers used in spaceborne transmitter technologies at frequencies through 100 GHz. Projected are future trends in power PHEMTs and in wide bandgap semiconductor devices such as GaN and SiC. Also, the more established InP HEMT low-noise devices are examined for possible power amp applications specifically in the millimeter wave region. Three key power amplifier technologies, including the traveling wave tube amplifier (TWTA), the solid state power amplifier (SSPA), and the microwave power module (MPM), have emerged in varying degrees as heritaged and/or viable components in spaceborne transmitters. Addressed as figures of merit are significant discriminators such as long term reliability, space heritage (failure-free on orbit performance), process/device maturity, size, weight, and efficiency
Keywords :
MESFET integrated circuits; MMIC power amplifiers; millimetre wave amplifiers; modules; power HEMT; radio transmitters; satellite communication; travelling wave amplifiers; 100 GHz; GaN; InP; MESFET; MPM based transmitters; SiC; TWT based transmitters; efficiency; failure-free on orbit performance; figures of merit; long term reliability; low-noise devices; microwave power amplifiers; microwave power module; millimeter wave region; power PHEMT; power amp applications; process/device maturity; remote sensing satellites; size; solid state power amplifier; solid state transmitters; space heritage; spaceborne applications; spaceborne transmitter; traveling wave tube amplifier; weight; wide bandgap semiconductor devices; Frequency; Microwave amplifiers; Microwave devices; Microwave technology; Millimeter wave technology; PHEMTs; Power amplifiers; Solid state circuits; Space technology; Transmitters;
Conference_Titel :
Southeastcon '98. Proceedings. IEEE
Conference_Location :
Orlando, FL
Print_ISBN :
0-7803-4391-3
DOI :
10.1109/SECON.1998.673343