• DocumentCode
    3206204
  • Title

    Pulse power electromagnetic fields, rep-rate influence on electromagnetic effects

  • Author

    Palisek, L. ; Suchy, L.

  • Author_Institution
    Div. VTUPV Vyskov, VOP-026 Sternberk, s.p., Vyskov, Czech Republic
  • fYear
    2009
  • fDate
    June 28 2009-July 2 2009
  • Firstpage
    1244
  • Lastpage
    1249
  • Abstract
    Some results obtained during experimental measurements of susceptibility of electronics to HPM and UWB irradiation with repetition rate signals are presented in this paper. Repetition rate dependence is considered for temporary failures as well as for damage levels too. As equipments under test are chosen regular PC setups. Simple electronic circuit are added for some experiments for possibility to achieve more results related to damage levels. Suitable simplified circuit models for HPM and UWB repetition rate effectiveness for achieving of typical effects on electronics is used for simulations. For this purpose model based on electro-thermal analogy is used within the software OrCAD 15.7 (PSpice model) environment. Results from measurements are compared with results from simulations. At the end of this presentation recommendation for effective HPM and UWB rep-rate necessary to achieve typical failures of tested equipments is carried out.
  • Keywords
    circuit simulation; electromagnetic fields; microwave circuits; PSpice model; electromagnetic effects; electrothermal analogy; high power microwave irradiation; pulse power electromagnetic fields; rep-rate influence; repetition rate signals; software OrCAD 15.7; ultra wide bandwidth irradiation; Circuit simulation; Converters; EMP radiation effects; Electromagnetic fields; Electromagnetic measurements; Frequency; Microwave devices; Optical sensors; Pulse measurements; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Pulsed Power Conference, 2009. PPC '09. IEEE
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-4064-1
  • Electronic_ISBN
    978-1-4244-4065-8
  • Type

    conf

  • DOI
    10.1109/PPC.2009.5386419
  • Filename
    5386419