An Analytical approach for estimation of EMC performance of Electro Explosive Device (EED) package

Author

Raghavaiah, Vaddi ; Satyadev, Singh Kamlesh ; Bandlamudi, Satish Kumar ; Mishra, P.K. ; Renuka, R. ; Nagesh, S.K. ; Thyagaraj, M.R. ; Rajan, G.V.C. ; Govinda, K.V.

Author_Institution

Electr. Design & Meas. Div., ISRO Satellite Centre (ISAC), Bangalore, India

fYear

2013

fDate

13-15 Dec. 2013

Firstpage

1

Lastpage

6

Abstract

In a spacecraft, the Electro Explosive Devices (EED) are used for the appendages deployment activities like Antennas Deployment, Solar arrays deployment etc. EED electronics package provides the required excitation to fire the SQUIB. During the launch phase, the spacecraft experiences a high level of Electromagnetic (EM) radiation. The EEDs should not get enabled due to the EM radiation. EMC analysis was carried out on EED package to assess the safety margin for the squibs, when it is subjected to the radiated E-fields and conducted noise. Micro-cap and CST cable studio software´s are used to simulate conducted susceptibility and radiated susceptibility EMC margins respectively.

Keywords

electromagnetic compatibility; electronics packaging; space vehicle electronics; space vehicles; CST cable studio software; EED electronic package; EM radiation; EMC analysis; EMC performance estimation; Micro-cap cable studio software; SQUIB; analytical approach; antenna deployment; conducted noise; conducted susceptibility EMC margin; electroexplosive device package; launch phase; radiated E-fields; radiated susceptibility EMC margin; safety margin; solar array deployment; spacecraft; Cable shielding; Fires; Integrated circuit modeling; Noise; Power cables; Relays; Wires; CST cable studio; Electro Explosive Device (EED); Micro-cap; Radiated susceptibility (RS); SQUIB; conducted susceptibility (CS);

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Photonics (ICMAP), 2013 International Conference on

Conference_Location

Dhanbad

Print_ISBN

978-1-4799-2176-8

Type

conf

DOI

10.1109/ICMAP.2013.6733463

Filename

6733463