DocumentCode :
3206578
Title :
A robust semi-automatic approach for ROI segmentation in 3D CT images
Author :
Kongkuo Lu ; Zhong Xue ; Wong, Stephen T.
Author_Institution :
Philips Res. North America, Briarcliff Manor, NY, USA
fYear :
2013
fDate :
3-7 July 2013
Firstpage :
5119
Lastpage :
5122
Abstract :
In CT-based clinical applications, segmentation of regions of interest (ROIs) is a preliminary but vital step. The task is, however, quite challenging, especially for 3D objects, because suspicious ROIs are usually soft-tissue structures, which include a various organs and anatomical objects while sharing a small intensity dynamic range in CT images. Furthermore, the ROIs usually vary significantly in size, shape, and boundary conditions. Among considerable efforts contributed to addressing the problem, live wire, also known as intelligent scissors, has been recognized as an efficient and robust tool for dealing with a wide range of 2D ROIs. Such an approach provides full user control during the process while minimizing human interaction to optimally counterbalance automatic and manual approaches. In this work, we improve our previous live-wire-based segmentation of 3D objects and the experiment results show its efficiency and robustness.
Keywords :
biological tissues; cellular biophysics; computerised tomography; image segmentation; medical image processing; 2D ROI; 3D CT images; 3D objects; ROI segmentation; boundary conditions; full user control; intelligent scissors; live-wire-based segmentation; optimal counterbalance automatic approaches; optimal counterbalance manual approaches; regions of interest segmentation; robust semiautomatic approach; small intensity dynamic range; soft-tissue structures; Computed tomography; Image segmentation; Liver; Lymph nodes; Three-dimensional displays; Tumors; Wires; CT; Lung cancer; live wire; liver cancer; semi-automatic segmentation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location :
Osaka
ISSN :
1557-170X
Type :
conf
DOI :
10.1109/EMBC.2013.6610700
Filename :
6610700
Link To Document :
بازگشت