DocumentCode
3208607
Title
Quasi static analysis of microstrip bondwire interconnects
Author
Alimenti, F. ; Goebel, U. ; Sorrentino, Roberto
Author_Institution
Istituto di Elettronica, Perugia Univ., Italy
fYear
1995
fDate
16-20 May 1995
Firstpage
679
Abstract
A quasi-static approach for the analysis of microstrip bondwire interconnects is presented. The bondwire has been modelled as a cascade of inhomogeneous and nonuniform transmission lines, using the conformal-mapping method to determine the line characteristics and the theory of nonuniform transmission lines to evaluate the effect of the variable height of the wire over the substrate.<>
Keywords
MMIC; Riccati equations; finite difference methods; integrated circuit interconnections; microstrip couplers; nonlinear differential equations; transmission line theory; 2D finite difference method; Riccati equation; conformal-mapping method; effective dielectric constant; inhomogeneous nonuniform transmission lines; microstrip bondwire interconnects; microwave MIC modules; quasistatic analysis; transmission line cascade model; variable wire height; Bonding; Dielectric substrates; Distributed parameter circuits; Magnetic analysis; Microstrip; Permittivity; Radio frequency; Riccati equations; Transmission line theory; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1995., IEEE MTT-S International
Conference_Location
Orlando, FL, USA
ISSN
0149-645X
Print_ISBN
0-7803-2581-8
Type
conf
DOI
10.1109/MWSYM.1995.406016
Filename
406016
Link To Document