DocumentCode
320906
Title
C-shield parylene allows major weight saving for EM shielding of microelectronics
Author
Noordegraaf, Jan ; Hul, Harry
Author_Institution
Nova Tran Ltd., UK
fYear
1997
fDate
26-30 Oct 1997
Firstpage
189
Lastpage
196
Abstract
Parylene is a conformal polymer film that has been used as a protective conformal coating for more than 25 years. It provides environmental and dielectric isolation in a variety of applications, industrial and automotive sensors, electronic circuits, hybrids, various medical substrates, and is also used extensively for corrosion protection and electrical insulation of ferrites and magnets. The most important performance specifications for a conformal coating are (1) uniformity and completeness of coverage, and (2) physical, electrical, chemical, mechanical, and barrier properties. Parylene offers significant performance capabilities in both of these areas. As a nonsolvent based coating, parylene is not affected by volatile organic compound (VOC) restrictions, and it is not implicated in the ozone depletion concerns of the Montreal Protocol and other environmental legislation. The parylene vacuum condensation process is now also capable of producing a dissipative parylene `C-shield´ that allows packaging of microelectronics with both the environmental protection offered by parylene and the dissipation of undesired stray EM radiation. This eliminates encapsulation with metal boxes and allows major cost and weight savings
Keywords
coating techniques; conformal coatings; corrosion protective coatings; electromagnetic shielding; encapsulation; environmental factors; integrated circuit packaging; polymer films; C-shield parylene; EM shielding; IC packaging; Montreal Protocol; barrier properties; chemical properties; corrosion protection; cost savings; coverage completeness; coverage uniformity; dielectric isolation; dissipative parylene C-shield; electrical insulation; electrical properties; encapsulation; environmental isolation; environmental legislation; environmental protection; mechanical properties; microelectronics; nonsolvent based coating; ozone depletion; parylene conformal polymer film; parylene vacuum condensation process; physical properties; protective conformal coating; stray EM radiation; volatile organic compound restrictions; weight saving; Automotive engineering; Chemical sensors; Coatings; Dielectric substrates; Electronic circuits; Electronics industry; Magnetic sensors; Mechanical sensors; Polymer films; Protection;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location
Norrkoping
Print_ISBN
0-7803-3865-0
Type
conf
DOI
10.1109/PEP.1997.656489
Filename
656489
Link To Document