Effects of underfill encapsulant on the mechanical and electrical performance of a functional flip chip device

Author

Lau, John ; Chang, Chris ; Chen, Ray

Author_Institution

Express Packaging Syst. Inc., Palo Alto, CA, USA

fYear

1997

fDate

26-30 Oct 1997

Firstpage

265

Lastpage

272

Abstract

The curing conditions and material properties such as the coefficient of thermal expansion, glass transition temperature, Young´s modulus, and moisture content of four different underfill encapsulants with different size and content of filler and epoxy are measured. The effects of these underfills on the flow rate, mechanical performance, and electrical performance of a solder-bumped functional flip chip on an organic substrate are studied

Keywords

Young´s modulus; encapsulation; flip-chip devices; glass transition; heat treatment; integrated circuit packaging; microassembling; moisture; soldering; thermal expansion; Young´s modulus; coefficient of thermal expansion; curing conditions; electrical performance; epoxy content; filler content; filler size; flip chip device; flow rate; glass transition temperature; material properties; mechanical performance; moisture content; organic substrate; solder-bumped functional flip chip; underfill encapsulant; underfill encapsulants; Bonding; Curing; Flexible printed circuits; Flip chip; Material properties; Moisture; Polymer films; Semiconductor device measurement; Substrates; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on

Conference_Location

Norrkoping

Print_ISBN

0-7803-3865-0

Type

conf

DOI

10.1109/PEP.1997.656499

Filename

656499