High performance underfills development - materials, processes, and reliability

Author

Nguyen, L. ; Hoang, L. ; Fine, P. ; Shi, S. ; Vincent, M. ; Wang, L. ; Wong, C.P. ; Tong, Q. ; Ma, B. ; Humphreys, R. ; Savoca, A.

Author_Institution

Nat. Semicond. Corp., Santa Clara, CA, USA

fYear

1997

fDate

26-30 Oct 1997

Firstpage

300

Lastpage

306

Abstract

The typical underfill enhances the solder life of flip chip structures by up to an order of magnitude. With increasing packaging applications requiring flip chip interconnection, much industry interest has been devoted to the development of better underfill materials, which are more cost-effective and provide better performance than current commercial materials. This paper presents the highlights of a recent DARPA-funded program to develop new underfill materials for low-cost flip chip applications

Keywords

assembling; circuit reliability; encapsulation; filled polymers; flip-chip devices; integrated circuit packaging; polymer films; soldering; cost-effectiveness; flip chip applications; flip chip interconnection; flip chip structures; packaging applications; solder life; underfill; underfill development; underfill materials; underfill processes; underfill reliability; Assembly; Chemical technology; Curing; Flip chip; Large scale integration; Materials reliability; Resins; Semiconductor materials; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on

Conference_Location

Norrkoping

Print_ISBN

0-7803-3865-0

Type

conf

DOI

10.1109/PEP.1997.656503

Filename

656503