DocumentCode :
3209321
Title :
Large Package Transfer Molded DIP-IPM
Author :
Motto, E. ; Donlon, J. ; Shang, Ming ; Kuriaki, Kazuhiro ; Iwagami, Toru ; Kawafuji, Hisashi ; Nakano, Toshiya
Author_Institution :
Powerex Inc., Youngwood, PA
fYear :
2008
fDate :
5-9 Oct. 2008
Firstpage :
1
Lastpage :
5
Abstract :
This paper presents a new larger version of the dual in-line package transfer molded Intelligent Power Module (DIP-IPM) developed by Mitsubishi Electric for home appliance motor control. The new large DIP-IPM utilizes a high thermal conductivity insulating resin sheet and an integrated aluminum heat spreader to provide the reduced thermal impedance and mechanical integrity required for a higher power applications. Using this approach the range DIP-IPM ratings has now been extended to 75 A at 600 V and 35 A at 1200 V. Like the lower power DIP-IPMs the new large DIP has high voltage integrated circuit (HVIC) based level shifting gate drive with short circuit protection and under voltage lock-out. However, in order to avoid the need for an excessively large current sensing resistor the new DIP uses IGBT chips with a current mirror emitter that produces a low level current proportional to the main emitter current for short circuit detection. In addition, the new DIP-IPM also provides an analog feedback signal proportional the module´s temperature.
Keywords :
domestic appliances; electric motors; electronics packaging; insulated gate bipolar transistors; power integrated circuits; IGBT chip; Mitsubishi Electric; analog feedback signal; current mirror emitter; dual in-line package; high voltage integrated circuit; home appliance motor control; integrated aluminum heat spreader; intelligent power module; large package transfer molded DIP-IPM; short circuit detection; thermal conductivity insulating resin sheet; Aluminum; Circuits; Electronics packaging; Home appliances; Impedance; Insulation; Motor drives; Multichip modules; Resins; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industry Applications Society Annual Meeting, 2008. IAS '08. IEEE
Conference_Location :
Edmonton, Alta.
ISSN :
0197-2618
Print_ISBN :
978-1-4244-2278-4
Electronic_ISBN :
0197-2618
Type :
conf
DOI :
10.1109/08IAS.2008.12
Filename :
4658800
Link To Document :
بازگشت