The integration of surface micromachined devices with optoelectronics: technology and applications

Author

Warren, M.E. ; Blum, O. ; Sullivan, C.T. ; Shul, R.J. ; Rodgers, M.S. ; Sniegowski, J.J.

Author_Institution

Sandia Nat. Labs., Albuquerque, NM, USA

fYear

1998

fDate

20-24 July 1998

Abstract

We describe efforts in integrating MEMS and optoelectronic or photonic functions and the fabrication constraints on both system components. The MEMS technology used in this work are silicon surface-machined systems fabricated using the SUMMiT (Sandia ultraplanar multilevel MEMS technology) process developed at Sandia. This process includes chemical-mechanical polishing as an intermediate planarization step to allow the use of 4 or 5 levels of polysilicon.

Keywords

chemical mechanical polishing; integrated optoelectronics; micro-optics; micromachining; micromechanical devices; optical fabrication; silicon; MEMS; MEMS technology; SUMMiT; Sandia ultraplanar multilevel MEMS technology; Sandia ultraplanar multilevel MEMS technology process; Si; chemical-mechanical polishing; fabrication constraints; intermediate planarization step; optoelectronics; photonic functions; polysilicon; silicon surface-machined systems; surface micromachined devices; system components; Chemical technology; Dielectric substrates; Micromechanical devices; Optical beams; Optical devices; Optical surface waves; Optoelectronic and photonic sensors; Packaging; Silicon; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Broadband Optical Networks and Technologies: An Emerging Reality/Optical MEMS/Smart Pixels/Organic Optics and Optoelectronics. 1998 IEEE/LEOS Summer Topical Meetings

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-4953-9

Type

conf

DOI

10.1109/LEOSST.1998.689703

Filename

689703