DocumentCode
3209792
Title
PIC-MCC modeling of dusty plasma
Author
Gupta, S. ; Gupta, N.
Author_Institution
Dept. of Electr. Eng., Indian Inst. of Technol. Kanpur, Kanpur, India
fYear
2009
fDate
1-5 June 2009
Firstpage
1
Lastpage
1
Abstract
Summary form only given: Dust particles may occur in RF (radio-frequency) discharges for a host of reasons; these include gas-phase nucleation and coagulation within the plasma itself and trapping of dust particles from sputtering and etching of wall material and other external sources. The dust particles are most often negatively charged due to electron capture from the plasma. When the amount of dust accumulation is sufficiently large, it modifies the plasma evolution and the discharge characteristics. In this work, we develop a PIC-MCC based two dimensional model to study the behaviour of a dusty radio frequency discharge in Argon. The simulation model effectively includes not only the ion and electron interaction with each other and the neutral gas molecules but also charged-particle interactions with the dust. The dust particles are assumed to be immobile, however their charge content and mass may grow due to capture of electrons or positive ions. Scattering interactions are also modeled. The evolution of the discharge parameters are traced under the dynamically changing dust content. The effect of various parameters like gas pressure and initial dust loading are studied. The evolution of the charge on the dust plasma and the corresponding change in discharge parameter is traced.
Keywords
argon; discharges (electric); dusty plasmas; plasma simulation; Ar; PIC-MCC gas pressure; PIC-MCC modeling; charged-particle interactions; dust accumulation; dusty plasma; dusty radio frequency discharge; electron capture; electron interaction; etching; gas-phase nucleation; neutral gas molecules; radio-frequency discharges; scattering interactions; wall material; Coagulation; Dusty plasma; Electron traps; Fault location; Plasma applications; Plasma materials processing; Plasma properties; Plasma simulation; Plasma sources; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science - Abstracts, 2009. ICOPS 2009. IEEE International Conference on
Conference_Location
San Diego, CA
ISSN
0730-9244
Print_ISBN
978-1-4244-2617-1
Type
conf
DOI
10.1109/PLASMA.2009.5227232
Filename
5227232
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