DocumentCode :
3209927
Title :
640×480 pixel active-matrix HEED imaging sensor with HARP target
Author :
Negishi, N. ; Sato, T. ; Matsuba, Y. ; Tanaka, R. ; Nakada, T. ; Sakemura, K. ; Okuda, Y. ; Watanabe, A. ; Yoshikawa, T. ; Ogasawara, K. ; Nanba, M. ; Okazaki, S. ; Tanioka, K. ; Egami, N. ; Koshida, N.
Author_Institution :
Pioneer Corp., Tokyo
fYear :
2007
fDate :
8-12 July 2007
Firstpage :
68
Lastpage :
69
Abstract :
In this paper, an active-matrix planar-type cold electron emitter array development is studied to fulfill the requirement of high-speed response. This emitter array adopts a novel MIS emitter which is termed HEED (High-efficiency Electron Emission Device) and fabricated on a MOS transistor array formed on a silicon wafer with scan driver circuits. HEED´s driving voltage is relatively low (about 20V) and its MIS structure is compatible with silicon planar processing employed for LSI. As a consequence, The HEED is one of the most suitable emitters for an active-matrix drive configuration. The emission current density (defined as the average pixel current per emitter area size) reaches up to 4.4 A/cm . This highly emissive property fulfills the imaging requirement of a HARP target. The specifications of the active-matrix HEED are summarized. The number of the interconnections to drive this chip is applicatory 12 lines. This is another important advantage of the active-matrix drive method.
Keywords :
MOSFET; driver circuits; image sensors; photoconducting devices; silicon; 640times480 pixel active-matrix; HARP target; MIS emitter; MOS transistor array; active-matrix HEED imaging sensor; driver circuits; high-efficiency electron emission device; high-gain avalanche rushing amorphous photoconductor; silicon wafer; Active matrix technology; Driver circuits; Electron emission; Electron guns; Image sensors; Large scale integration; Low voltage; MOSFETs; Pixel; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Nanoelectronics Conference, 2007. IVNC. IEEE 20th International
Conference_Location :
Chicago, IL
Print_ISBN :
978-1-4244-1133-7
Electronic_ISBN :
978-1-4244-1134-4
Type :
conf
DOI :
10.1109/IVNC.2007.4480935
Filename :
4480935
Link To Document :
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